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Rulon Bearings

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Epoxy Technology EPO-TEK® OE188 High Temperature Silica-Filled Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.

Advantages & Application Notes:

  • Paste-like viscosity allows for application by dispensing, or hand methods such as toothpick, spatula or pin transfer.
  • Color change upon cure – off-white to amber-brown - allows easy visual inspection.
  • The CTE value below the Tg keeps potential stress to a minimum.
  • Suggested applications:
    • Fiber Optic Packaging
      • Sealing fiber into the snout, ferrule, or feed-through of the opto-package.
      • Mounting optics, such as lenses, diodes, prisms, onto the substrate or “optical bench.”
      • Adhesive for building the optical bench to the correct Z-height.
      • “Toughened” adhesive to prevent fiber from the “piston effect”.
    • Semiconductor
      • As underfill of flip chip devices and SMDs like BGAs, capacitors and resistors.
    • Medical
      • As an alternative to EPO-TEK® 353ND for moisture resistance.
  • Capable of short cure cycles at low temperature, such as 80°C.

Information Provided by Epoxy Technology

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesOriginal ValueComments
Specific Gravity 1.02 g/ccPart B
 1.55 g/ccPart A
Particle Size <= 45 µm
Viscosity 20000 - 30000 cP
@Temperature 23.0 °C
10 rpm
 
Chemical PropertiesOriginal ValueComments
Ionic Impurities - Na (Sodium) 9.0 ppm
Ionic Impurities - Cl (Chloride) 188 ppm
 
Mechanical PropertiesOriginal ValueComments
Hardness, Shore D 91
Tensile Modulus 782800 psiStorage
Shear Strength 1584 psiLap
 >= 5100 psiDie
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity >= 7.00e+12 ohm-cm
Dielectric Constant 3.56
@Frequency 1000 Hz
Dissipation Factor 0.0030
@Frequency 1000 Hz
 
Thermal PropertiesOriginal ValueComments
CTE, linear 19.0 µm/m-°CBelow Tg
 68.0 µm/m-°CAbove Tg
Maximum Service Temperature, Air 225 °CContinuous
 325 °CIntermittent
Minimum Service Temperature, Air -55.0 °CContinuous
 -55.0 °CIntermittent
Glass Transition Temp, Tg >= 90.0 °CDynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 417 °CDegradation Temperature
 
Processing PropertiesOriginal ValueComments
Cure Time 1.00 min
@Temperature 150 °C
minimum
 5.00 min
@Temperature 120 °C
minimum
 10.0 min
@Temperature 100 °C
minimum
 30.0 min
@Temperature 80.0 °C
minimum
Pot Life 90 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
 
Descriptive Properties
ColorAmberPart B
 Off-WhitePart A
ConsistencySmooth paste
Ionic Impurities NH4304 ppm
Mix Ratio by Weight20:1
Number of ComponentsTwo
Thixotropic Index1.1
Weight Loss0.78%200°C
 1.9%300°C

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