Lord Adhesives CircuitSAF™ ME-456 Epoxy Dam Encapsulant

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Lord Adhesives CircuitSAF™ ME-456 Epoxy Dam Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	CircuitSAF™ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAF™ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAF™ ME-455, and both materials can be cured at the same time. All information provided by Lord.
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Physical Properties	Metric	English	Comments

Specific Gravity	1.80 g/cc	1.80 g/cc
Water Absorption	0.60 % @Temperature 100 °C, Time 86400 sec	0.60 % @Temperature 212 °F, Time 24.0 hour
Brookfield Viscosity	1.10e+6 cP @Temperature 25.0 °C	1.10e+6 cP @Temperature 77.0 °F	Spindle #7 @ 1rpm

Mechanical Properties	Metric	English	Comments
Modulus of Elasticity	6.00 GPa	870 ksi	DMA

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.6 @Frequency 1e+6 Hz	3.6 @Frequency 1e+6 Hz	ASTM D150-98
Dissipation Factor	0.0060 @Frequency 1e+6 Hz	0.0060 @Frequency 1e+6 Hz	ASTM D150-98

Thermal Properties	Metric	English	Comments
CTE, linear	19.0 µm/m-°C	10.6 µin/in-°F	Alpha 1; ASTM D3386
	60.0 µm/m-°C	33.3 µin/in-°F	Alpha 2; ASTM D3386
Glass Transition Temp, Tg	135 °C	275 °F	DSC; ASTM D3418

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 150 °C	0.500 hour @Temperature 302 °F
Pot Life	2160 min @Temperature 25.0 °C	2160 min @Temperature 77.0 °F
Gel Time	4.00 min @Temperature 150 °C	4.00 min @Temperature 302 °F
Shelf Life	6.00 Month @Temperature -40.0 °C	6.00 Month @Temperature -40.0 °F

Component Elements Properties	Metric	English	Comments
Potassium, K	<= 0.00010 %	<= 0.00010 %
Sodium, Na	<= 0.00050 %	<= 0.00050 %

Descriptive Properties
Chloride (%)	< 0.0005
Thixotropic Index	4.7

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