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Rulon Bearings

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Lord Adhesives CircuitSAF™ ME-456 Epoxy Dam Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: CircuitSAF™ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAF™ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAF™ ME-455, and both materials can be cured at the same time.

All information provided by Lord.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.80 g/cc
Water Absorption 0.60 %
@Temperature 100 °C,
Time 86400 sec
Brookfield Viscosity 1.10e+6 cP
@Temperature 25.0 °C
Spindle #7 @ 1rpm
 
Mechanical PropertiesOriginal ValueComments
Modulus of Elasticity 6.00 GPaDMA
 
Electrical PropertiesOriginal ValueComments
Dielectric Constant 3.6
@Frequency 1e+6 Hz
ASTM D150-98
Dissipation Factor 0.0060
@Frequency 1e+6 Hz
ASTM D150-98
 
Thermal PropertiesOriginal ValueComments
CTE, linear 19.0 µm/m-°CAlpha 1; ASTM D3386
 60.0 µm/m-°CAlpha 2; ASTM D3386
Glass Transition Temp, Tg 135 °CDSC; ASTM D3418
 
Processing PropertiesOriginal ValueComments
Cure Time 30.0 min
@Temperature 150 °C
Pot Life 2160 min
@Temperature 25.0 °C
Gel Time 4.00 min
@Temperature 150 °C
Shelf Life 6.00 Month
@Temperature -40.0 °C
 
Component Elements PropertiesOriginal ValueComments
Potassium, K <= 0.00010 %
Sodium, Na <= 0.00050 %
 
Descriptive Properties
Chloride (%)< 0.0005
Thixotropic Index4.7

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