Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy

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Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive
Material Notes:	Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E. Advantages & Application Notes: Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired. Suggested for JEDEC Level III and II for plastic IC packaging. Capable of resisting TC wire bonding temperatures in the 300°C range. Ease of use: apply by dispensing, screen printing, or by hand. Especially suited for high power devices and high current flow. High power LEDs. Opto-electronic packaging material: LED, LCDs, and fiber optic components. Information Provided by Epoxy Technology
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Physical Properties	Metric	English	Comments

Specific Gravity	2.72 g/cc	2.72 g/cc	Part A
	4.33 g/cc	4.33 g/cc	Part B
Particle Size	<= 45 µm	<= 45 µm
Viscosity	10000 - 20000 cP @Temperature 23.0 °C	10000 - 20000 cP @Temperature 73.4 °F	20 rpm

Chemical Properties	Metric	English	Comments
Ionic Impurities - Cl (Chloride)	141 ppm	141 ppm

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	66	66
Tensile Modulus	5.46 GPa	791 ksi	Storage
Shear Strength	8.384 MPa	1216 psi	Lap
	>= 11.7 MPa	>= 1700 psi	Die

Electrical Properties	Metric	English	Comments
Volume Resistivity	<= 0.00040 ohm-cm	<= 0.00040 ohm-cm

Thermal Properties	Metric	English	Comments
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	Below Tg
	111 µm/m-°C	61.7 µin/in-°F	Above Tg
Thermal Conductivity	3.50 W/m-K	24.3 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	250 °C	482 °F	Continuous
	350 °C	662 °F	Intermittent
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F	Continuous
	-55.0 °C	-67.0 °F	Intermittent
Glass Transition Temp, Tg	>= 80.0 °C	>= 176 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature	470 °C	878 °F	Degradation Temperature

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F	Minimum Bond Line
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F	Minimum Bond Line
	90.0 min @Temperature 80.0 °C	1.50 hour @Temperature 176 °F	Minimum Bond Line
Pot Life	4320 min	4320 min
Shelf Life	12.0 Month @Temperature 25.0 °C	12.0 Month @Temperature 77.0 °F

Descriptive Properties
Color	Silver		Part A
	Silver		Part B
Consistency	Thixotropic paste
Ionic Impurities NH₄	265 ppm
Mix Ratio by Weight	1:1
Number of Components	Two
Thixotropic Index	4.85
Weight Loss	0.25%		200°C
	0.37%		250°C
	0.79%		300°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PPOXYT029 / 141068

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