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Metal adhesives

Resinlab® EP1320 Heat Cure Epoxy Conformal Coating
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. These products give very good environmental protection and dielectric properties over a wide temperature range. The primary difference between the two versions is the LV version has a lower high shear viscosity (higher press flow rate) to provide easier dispensing. The amount of sag upon curing is the same.

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.30 g/cc1.30 g/ccTM R050-16
Water Absorption 0.13 %
@Time 86400 sec
0.13 %
@Time 24.0 hour
TM R050-35
Viscosity 82000 cP
@Shear Rate 1.00 1/s
82000 cP
@Shear Rate 1.00 1/s
Mixed
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 8585
Tensile Strength at Break 34.5 MPa5000 psiTM R050-36
Tensile Strength, Ultimate 34.5 MPa5000 psiTM R050-36
Tensile Strength, Yield 20.7 MPa3000 psiTM R050-36
Elongation at Break 0.00 - 1.0 %0.00 - 1.0 %TM R050-36
Tensile Modulus 4.83 GPa700 ksiTM R050-36
Compressive Yield Strength 82.7 MPa12000 psiTM R050-38
Compressive Strength 124 MPa18000 psiBreak; TM R050-38
 138 MPa20000 psiUltimate; TM R050-38
Compressive Modulus 3.79 GPa550 ksiTM R050-38
Adhesive Bond Strength 8.96 MPa1300 psiLap Shear-Aluminum
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 3.00e+16 ohm-cm3.00e+16 ohm-cm
Dielectric Constant  3.4
@Frequency 100000 Hz
3.4
@Frequency 100000 Hz
 3.8
@Frequency 100 Hz
3.8
@Frequency 100 Hz
Dielectric Strength 17.3 kV/mm440 kV/in
Dissipation Factor  0.030
@Frequency 100 Hz
0.030
@Frequency 100 Hz
 0.030
@Frequency 100000 Hz
0.030
@Frequency 100000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear  58.0 µm/m-°C
@Temperature <=95.0 °C
32.2 µin/in-°F
@Temperature <=203 °F
Below Tg
 200 µm/m-°C
@Temperature >=95.0 °C
111 µin/in-°F
@Temperature >=203 °F
Above Tg
Thermal Conductivity 0.300 W/m-K2.08 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 150 °C302 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 95.0 °C203 °F
 
Processing PropertiesMetricEnglishComments
Cure Time  5.00 - 10.0 min
@Temperature 150 °C
0.0833 - 0.167 hour
@Temperature 302 °F
 15.0 min
@Temperature 120 °C
0.250 hour
@Temperature 248 °F
 30.0 min
@Temperature 110 °C
0.500 hour
@Temperature 230 °F
 
Descriptive Properties
Appearanceblack semi-paste
Mix Ratio by Volumeone part
Side-By-Side Cartridges CapableNo

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PRESL138 / 101552

Metal adhesives

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