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Victrex APTIV™ 2000-050 Polyetheretherketone (PEEK) Polymer Film, Amorphous
Categories: Polymer; Film; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)
Material Notes: APTIV™ PEEK 2000 series films are unfilled amorphous films made from VICTREX™ PEEK polymer. The film provides a material solution for engineers in ultra-high performance applications.

APTIV PEEK 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler.

Applications:

  • Aerospace insulation
  • Electrical Insulation
  • Acoustic speaker diaphragms
  • Thermoforming of thin wall parts
  • Composites

All information provided by Victrex.

Properties measured on 50 micron film
Vendors: Victrex is a global leader in high-performance PEEK and PAEK polymers, transforming industries from aerospace to medical devices. For 40 years, our innovative polymer solutions help customers achieve new levels of performance, sustainability, and cost efficiency across applications that millions rely on daily from smartphones to aircraft components. As pioneers in polymer engineering, we're committed to delivering transformational solutions that address global materials challenges. Visit www.victrex.com, call (800) VICTREX /1-484-342-6001, or email victrexplc@victrex.com.

Ensinger TECAPEEK™ shapes are manufactured exclusively with Victrex™ PEEK polymer. The Ensinger process and Victrex resins ensure reliability, consistency, dimensional stability, and high temperature mechanical performance.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.26 g/cc
@Temperature 23.0 °C		1.26 g/cc
@Temperature 73.4 °F		ISO 1183
Moisture Absorption at Equilibrium 0.21 %
@Temperature 23.0 °C,
Time 86400 sec		0.21 %
@Temperature 73.4 °F,
Time 24.0 hour		50% RH; ISO 62
 
Mechanical PropertiesMetricEnglishComments
Film Elongation at Break, MD >= 200 %>= 200 %ISO 527
 >= 200 %
@Thickness 0.0250 mm		>= 200 %
@Thickness 0.000984 in		ISO 527
 >= 200 %
@Thickness 0.0250 mm		>= 200 %
@Thickness 0.000984 in		ISO 527
Film Elongation at Break, TD >= 200 %>= 200 %ISO 527
 >= 200 %
@Thickness 0.100 mm		>= 200 %
@Thickness 0.00394 in		ISO 527
 >= 200 %
@Thickness 0.100 mm		>= 200 %
@Thickness 0.00394 in		ISO 527
Tensile Modulus 1.80 GPa261 ksiMD; ISO 527
 1.80 GPa261 ksiTD; ISO 527
 1.60 GPa
@Thickness 0.100 mm		232 ksi
@Thickness 0.00394 in		MD; ISO 527
 1.60 GPa
@Thickness 0.100 mm		232 ksi
@Thickness 0.00394 in		TD; ISO 527
 1.80 GPa
@Thickness 0.0250 mm		261 ksi
@Thickness 0.000984 in		MD; ISO 527
 1.80 GPa
@Thickness 0.0250 mm		261 ksi
@Thickness 0.000984 in		TD; ISO 527
Tear Strength 5.96 kN/m34.0 pliMD; ISO 6383-1
 5.96 kN/m34.0 pliTD; ISO 6383-1
Film Tensile Strength at Break, MD 120 MPa17400 psiISO 527
 120 MPa
@Thickness 0.0250 mm		17400 psi
@Thickness 0.000984 in		ISO 527
 130 MPa
@Thickness 0.0250 mm		18900 psi
@Thickness 0.000984 in		ISO 527
Film Tensile Strength at Break, TD 120 MPa17400 psiISO 527
 120 MPa
@Thickness 0.100 mm		17400 psi
@Thickness 0.00394 in		ISO 527
 130 MPa
@Thickness 0.100 mm		18900 psi
@Thickness 0.00394 in		ISO 527
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 2.00e+16 ohm-cm
@Temperature 23.0 °C		2.00e+16 ohm-cm
@Temperature 73.4 °F		100V; ASTM D257
Dielectric Constant 3.3
@Frequency 1e+7 Hz,
Temperature 23.0 °C		3.3
@Frequency 1e+7 Hz,
Temperature 73.4 °F
Dielectric Strength 190 kV/mm
@Temperature 23.0 °C		4830 kV/in
@Temperature 73.4 °F		1/4 inch electrode; ASTM D149
 120 kV/mm
@Thickness 0.100 mm		3050 kV/in
@Thickness 0.00394 in		ASTM D149
 270 kV/mm
@Thickness 0.0250 mm		6860 kV/in
@Thickness 0.000984 in		ASTM D149
Dielectric Breakdown  6750 V
@Thickness 0.0250 mm		6750 V
@Thickness 0.000984 in		ASTM D149
 9500 V
@Thickness 0.0500 mm		9500 V
@Thickness 0.00197 in		ASTM D149
 15000 V
@Thickness 0.100 mm		15000 V
@Thickness 0.00394 in		ASTM D149
Dissipation Factor 0.0030
@Frequency 1e+7 Hz,
Temperature 23.0 °C		0.0030
@Frequency 1e+7 Hz,
Temperature 73.4 °F		ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear 60.0 µm/m-°C33.3 µin/in-°FMD, below Tg; ASTM D696
Shrinkage, MD <= 10 %
@Temperature 200 °C		<= 10 %
@Temperature 392 °F		TM-VX-84
Shrinkage, TD <= 5.0 %
@Temperature 200 °C		<= 5.0 %
@Temperature 392 °F		TM-VX-84
 
Descriptive Properties
Puncture Strength (kJ/m²)40Def Stan 81-75; 23°C

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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