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Chemically Resistant adhesives

Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy, Novolac, Molding Compound

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.92 g/cc0.0694 lb/in³
Linear Mold Shrinkage 0.0050 - 0.0070 cm/cm0.0050 - 0.0070 in/in
Spiral Flow 64.0 - 90.0 cm25.2 - 35.4 in177°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7878
Tensile Strength, Ultimate 103 MPa14900 psi
Tensile Modulus 16.0 GPa2320 ksi
Flexural Strength 145 MPa21000 psi
Flexural Modulus 17.0 GPa2470 ksi
Izod Impact, Notched 0.250 J/cm0.468 ft-lb/in
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 4.08
@Frequency 1000 Hz
4.08
@Frequency 1000 Hz
Dielectric Strength 17.0 kV/mm432 kV/in
Dissipation Factor 0.0040
@Frequency 1000 Hz
0.0040
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 27.0 µm/m-°C
@Temperature 20.0 °C
15.0 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 81.0 µm/m-°C
@Temperature 20.0 °C
45.0 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 1.00 W/m-K6.94 BTU-in/hr-ft²-°F
Deflection Temperature at 1.8 MPa (264 psi) 218 °C424 °F
Glass Transition Temp, Tg 150 - 160 °C302 - 320 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 171 - 193 °C340 - 379 °FMolding temperature

**
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PCOOK306 / 21402

Chemically Resistant adhesives

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