Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound

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Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Novolac, Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
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Physical Properties	Original Value	Comments

Density	1.92 g/cc
Linear Mold Shrinkage	0.0050 - 0.0070 cm/cm
Spiral Flow	64.0 - 90.0 cm	177°C/1000 psi

Mechanical Properties	Original Value	Comments
Hardness, Shore D	78
Tensile Strength, Ultimate	103 MPa
Tensile Modulus	16.0 GPa
Flexural Strength	145 MPa
Flexural Modulus	17.0 GPa
Izod Impact, Notched	0.250 J/cm

Electrical Properties	Original Value	Comments
Dielectric Constant	4.08 @Frequency 1000 Hz
Dielectric Strength	17.0 kV/mm
Dissipation Factor	0.0040 @Frequency 1000 Hz

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	27.0 µm/m-°C @Temperature 20.0 °C
CTE, linear, Transverse to Flow	81.0 µm/m-°C @Temperature 20.0 °C
Thermal Conductivity	1.00 W/m-K
Deflection Temperature at 1.8 MPa (264 psi)	218 °C
Glass Transition Temp, Tg	150 - 160 °C
Flammability, UL94	V-0 @Thickness 3.20 mm
	V-0 @Thickness 3.20 mm

Processing Properties	Original Value	Comments
Processing Temperature	171 - 193 °C	Molding temperature

**
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PCOOK306 / 21402

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