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Master Bond adhesives

Sumitomo Bakelite North America Epiall® 1961B-1 Mineral and Glass Filled Electrical Encapsulation Grade Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Encapsulating, Glass or Mineral Filled; Filled/Reinforced Thermoset

Material Notes: Epiall 1961B-1 is a short glass fiber and mineral filled epoxy molding compound with excellent dimensional stability, good strength properties, and good electrical insulation properties.

Information provided by Sumitomo Bakelite North America, Inc.

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Physical PropertiesMetricEnglishComments
Bulk Density 0.900 g/cc0.0325 lb/in³ASTM D1895
Density 1.90 g/cc0.0686 lb/in³ASTM D792
Water Absorption 0.20 %
@Temperature 50.0 °C,
Time 173000 sec
0.20 %
@Temperature 122 °F,
Time 48.0 hour
ASTM D570
Linear Mold Shrinkage 0.0020 - 0.0040 cm/cm0.0020 - 0.0040 in/inASTM D955
 
Mechanical PropertiesMetricEnglishComments
Hardness, Barcol 6666ASTM D2583
Tensile Strength at Break 90.0 MPa13100 psiASTM D638
Flexural Strength 150 MPa21800 psiat rupture; ASTM D790
Flexural Modulus 16.0 GPa2320 ksiASTM D790
Compressive Strength 240 MPa34800 psiASTM D695
Izod Impact, Notched 0.350 J/cm0.656 ft-lb/inASTM D256
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 3.8
@Frequency 1e+6 Hz
3.8
@Frequency 1e+6 Hz
wet; ASTM D150
Dielectric Strength  12.9 kV/mm
@Frequency 60 Hz
328 kV/in
@Frequency 60 Hz
step-by-step, wet; ASTM D149
 13.7 kV/mm
@Frequency 60 Hz
348 kV/in
@Frequency 60 Hz
short time, wet; ASTM D149
Dissipation Factor 0.014
@Frequency 1e+6 Hz
0.014
@Frequency 1e+6 Hz
wet; ASTM D150
Arc Resistance 180 sec180 secASTM D495
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 16.0 µm/m-°C8.89 µin/in-°FASTM E831
CTE, linear, Transverse to Flow 32.0 µm/m-°C17.8 µin/in-°FASTM E831
Deflection Temperature at 1.8 MPa (264 psi) 260 °C500 °FPost Baked; ASTM D648A
 
Descriptive Properties
ColorsBlack, Red, Blue
FormGranular
Molding MethodInjection
 Transfer

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