| TSE328-G silicone adhesive is a one-component, low viscosity, thermally conductive material, which will remain in an uncured state at room temperature and cure to an elastomer when heat is applied. TSE3282-G provides much higher thermal conductivity than conventional silicone adhesives, which makes it ideal for electrical and electronic applications where high thermal transfer is required. it is non-corrosive to metals and has excellent adhesive properties to a wide variety of substrates, generally without the need for using a primer. For example, primerless adhesion is typically obtained on metals such as aluminum, copper, and nickel plate, PPS and PBT plastics, ceramics, and glass. Cured properties for specimen cured for 1 hour at 150°C. Key Performance Properties: - Excellent thermal conductivity
- Ready to use - once component
- Heat accelerated cure
- Excellent adhesive properties; this material offers primerless adhesion to many substrates
- Non corrosive to metals
GE Silicones became a part of Momentive Performance Materials in 2006. |
