Rogers Arlon TC350 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate

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Rogers Arlon TC350 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	Microwave material for improved thermal management - for microwave printed circuit boards Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures Very Low Loss Tangent provides higher Amplifier or Antenna Efficiency Easier to drill than traditional commercial based laminates utilizing thick and dense style woven glass Priced Affordably for Commercial Applications High Peel Strength for Reliable Copper Adhesion in thermally stressed applications Benefits: Heat Dissipation and Management Improved Processing and Reliability Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs Typical Applications: Power Amplifiers, Filters and Couplers Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB) Thermally Cycled Antennas sensitive to dielectric drift Microwave Combiner and Power Dividers Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
Outgassing - Total Mass Loss, NASA SP-R-0022A
Collected Volatile Condensable Material, NASA SP-R-0022A
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Flexural Strength, IPC TM-650 2.4.4, Cross
Flexural Strength, IPC TM-650 2.4.4, Machine
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3, may vary by thickness
Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
Dielectric Constant, Resonant Cavity, may vary by thickness
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor, IPC TM-650 2.5.5.3, may vary by thickness
Dissipation Factor, Resonant Cavity, may vary by thickness
Dissipation Factor, IPC TM-650 2.5.5.5, may vary by thickness
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Specific Heat Capacity, ASTM E1461
Thermal Conductivity, ASTM D5470
Decomposition Temperature, IPC TM-650 2.4.24.6, Initial
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Plastic

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