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Metal adhesives
Henkel Loctite® ABLESTIK 8008MD Adhesive
Categories: Polymer; Adhesive

Material Notes: Appearance: Silver

Product Benefits:

  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
  • Controlled bondline thickness
Cure: Heat cure

Application: Die attach

Filler Type: Silver

Substrates: PPF, Copper and Silver-plated copper leadframes

LOCTITE ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.

Information provided by Loctite®

Vendors:
Available Properties
  • Brookfield Viscosity, Uncured, CP51, Speed 5 rpm
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Tensile Modulus, Cured, DMTA
  • Volume Resistivity
  • Thermal Conductivity, Cured
  • Cure Time, ramp to 115°C + 60 minutes @ 115°C, Recommended B-Stage Condition
  • Cure Time, ramp to 175°C + 60 minutes @ 175°C, Recommended Cure Schedule
  • Working Life
  • Shelf Life, Uncured, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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Metal adhesives
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