| Product Description: EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications Advantages & Application Notes: - A moderate viscosity resin with flowing properties enables potting of cavities, packages and housings.
- Contains a coarse grade of filler, which needs to be taken into account in all bonding, sealing and potting applications.
- Pure white color after cure allows for easy inspection by operators on common electronic packaging surfaces.
- Versatility in cure: 23ºC and 100ºC ambient, box oven or tunnel oven processes.
- Suggested Applications:
- Hybrids: thermally conductive adhesive bonding ceramics and metals
- Electronics:
- General PCB level potting and adhesive applications. Bonding metal and composite heat sinks to PCBs or SMDs.
- Transformers: potting of Cu coils, magnets, inductors and other SMDs into their respective casing.
- Medical Devices
- Heat sinking of x-ray and ultrasound circuits via adhesive and potting processes.
Information Provided by Epoxy Technology |
