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Chemically Resistant adhesives
Epoxy Technology EPO-TEK® T905BN-4 Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Product Description: EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications

Advantages & Application Notes:

  • A moderate viscosity resin with flowing properties enables potting of cavities, packages and housings.
  • Contains a coarse grade of filler, which needs to be taken into account in all bonding, sealing and potting applications.
  • Pure white color after cure allows for easy inspection by operators on common electronic packaging surfaces.
  • Versatility in cure: 23ºC and 100ºC ambient, box oven or tunnel oven processes.
  • Suggested Applications:
    • Hybrids: thermally conductive adhesive bonding ceramics and metals
    • Electronics:
      • General PCB level potting and adhesive applications. Bonding metal and composite heat sinks to PCBs or SMDs.
      • Transformers: potting of Cu coils, magnets, inductors and other SMDs into their respective casing.
    • Medical Devices
      • Heat sinking of x-ray and ultrasound circuits via adhesive and potting processes.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Particle Size
  • Viscosity, 20 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 40—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  
Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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