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Master Bond adhesives
Honeywell TGP5000 Thermal Gap Pads
Categories: Other Engineering Material

Material Notes: Benefits And Features:
  • High thermal performance
  • Ultra-high compressibility for low stress applications
  • Excellent surface wetting for low contact resistance
  • High reliability
  • Electrically insulating
Overview: Honeywell Thermal Gap Pads (TGP) provide high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. Products are available in thickness range from 0.5mm to 5.0mm.

Typical Applications:

  • Consumer electronics
  • Telecommunications & network servers
  • Automotive electronics
  • Power devices & modules
  • Semiconductors logics & memory

Information provided by Honeywell

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Hardness, Shore OO, ASTM D2240
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Thermal Conductivity, ASTM D5470
  • Flammability, UL94
  • Shelf Life
  
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