Epoxy Potting and Encapsulating Systems for Electronic Applications High technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.
Cytec (Conap) RN-1000 / EA-117 Conapoxy® Resin / Conacure® Hardener An unfilled, low viscosity system with high heat distortion properties.
- Mix Ratio, Resin/Hardener (by weight): 100/20
Cure Type: Elevated Temperature Information provided by Cytec, subsequently acquired by Elantas. |