| LDS is becoming increasingly popular as the MID technology to enable an increased number of novel functions available inside appealing housings and covers, such as smart phones and notebooks. With LDS, tailored plastic materials are activated locally using a laser, and subsequently metalized exclusively in the activated areas, thus enabling a fast, highly flexible, 3D-design of, for instance, antennas in existing parts such as covers and frames. The XANTAR LDS portfolio is ideally suited for integrated mobile phone antennas from antenna carriers to fully integrated antennas in the housing or frame. The application area has now been extended to antennas in laptops and notebooks. Full Color custom-made PC- and PC/ABS-based grades are available that enable selective electroless plating by means of laser direct structuring (LDS) to integrate electric circuits into molded parts. For parts that require soldering, specially developed high-temperature Reny® LDS grades are available. Benefits of XANTAR® LDS for laser direct structuring technology (based on joint development with LPKF): Highest-impact material available for laser direct structuring. Halogen free flame retardant. Resolution (line/space) down to 100 microns. Extremely well suited for antennas in mobile phones and notebooks. Full color availability for PC- and PC/ABS based LDS grades. High-performance/robustness: Dielectric constant of PC/ABS helps to assure high antenna performance. Outstanding impact strength outperforms competitive PC-blends. Advantages of innovative LDS technology: Higher flexibility compared to other molded interconnect device (MID) technologies, providing faster time-to-market. Enables 3D shapes and electrical connections simultaneously. Suitable for relatively small surface areas. Only three process steps: molding, laser processing, metallization.Information provided by Mitsubishi Engineering Plastics Corporation. |
