Cure: Heat cure
Product Benefits:
Typical Package Application: CSP, WLCSP and BGA
LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
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Category NotesPlastic