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Master Bond adhesives
Henkel Loctite® ECCOBOND UF 3820 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Heat cure

Product Benefits:

  • High Tg
  • Easy rework
  • Halogen free
  • One component
  • Fast cure at moderate temperatures
  • Room temperature flow capability
  • High fracture toughness
  • Excellent thermal cycle performance
  • Compatible with most Pb-free solders
  • Stable electrical performance under thermal/humidity bias
Application: Underfill

Typical Package Application: CSP, WLCSP and BGA

LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.

Information provided by Loctite®

Available Properties
  • Specific Gravity
  • Brookfield Viscosity, CP50-1
  • Tensile Modulus, Storage, Cured, DMA
  • Tensile Modulus, Storage, Cured, DMA
  • Tensile Modulus, Storage, Cured, DMA
  • Tensile Modulus, Storage, Cured, DMA
  • Fracture Toughness, Instron
  • Shear Strength, PCB to PCB
  • Dielectric Constant
  • Dielectric Constant
  • Dielectric Constant
  • Dielectric Constant
  • Dissipation Factor
  • Dissipation Factor
  • Dissipation Factor
  • Dissipation Factor
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time, Alternate Cure Schedule
  • Cure Time, Alternate Cure Schedule
  • Cure Time
  • Working Life, Worklife, 25% change in viscosity
  • Shelf Life
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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