Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® T7109-17 Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® T7109-17 is a flexible, thermally conductive, electrically insulating epoxy paste designed for low stress and heat dissipation applications within the semiconductor, hybrid, electronic and optical industries. It is a replacement for EPO-TEK® T7109-14. Advantages & Application Notes: Suggested applications: Hybrids: bonding thermo-electric coolers (TEC’s) Power devices: adhesive for low-stress bonding of ferrites; laminating Cu foils to substrates Optics: Die-attaching µ-LCDs to PCB/substrate Flexible potting of kapton flex PCB containing µ-LCD into the frame Adhesive for OEM optics including profilometry Semiconductor: glob top over IC and wire bonds General: adhesive for Al, Cu, Kovar, ceramic, glass, PCBs, and most plastics Rheology allows deposition by hand, dispensers or screen printers. Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity, Part B
Specific Gravity, Part A
Particle Size
Viscosity, 5 rpm
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Lap
Shear Strength, Die
Volume Resistivity
Dielectric Constant
Dissipation Factor
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Pot Life
Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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