| Product Description: EPO-TEK® H62 is a single component, electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. Advantages & Application Notes: - Black and opaque appearance; it can block out light in opto-electronic devices.
- Semiconductor encapsulant for COB packaged die. It may be used as a glob top DAM around the chip.
- SMD “staking” material or Surface Mount Adhesive (SMA). The SMA may be used for double-sided PCB bonding of components; staking caps and resistors to ceramic or hybrid circuits. High viscosity adhesive paste has enough wet “green strength” to hold SMD’s to the PCB prior to cure.
- Alternatives are available in different viscosity ranges and colors.
- Excellent adhesion to ferrous and non-ferrous metals, glass, ceramics, PCB, and most plastics.
- Thixotropic paste appearance makes it capable of syringe dispensing techniques, stencil or screen printing, or hand applications by brush or spatula.
Information Provided by Epoxy Technology |
