MatWeb - Material Property Data Advertise with MatWeb!     Register Now
Data sheets for over 180,000 metals, plastics, ceramics, and composites.
MatWeb - Material Property Data HOME  •   SEARCH  •   TOOLS  •   SUPPLIERS  •   FOLDERS  •   ABOUT US  •   FAQ  •   LOG IN    
Recently Viewed Materials (most recent at top)  

Login to see your most recently viewed materials here.

Or if you don't have an account with us yet, then click here to register.

  Searches:   Advanced  | Category  | Property  | Metals  | Trade Name  | Manufacturer  | Recently Viewed Materials
  
Master Bond adhesives
Evonik NANOPOX® E 500 Silica Dispersion
Categories: Ceramic; Oxide; Silicon Oxide

Material Notes: NANOPOX® products are high-performance concentrates of nanosilica in epoxy resins and are especially de-signed for electrical and electronic applications. The silica phase consists of surface-modified SiO2 nanospheres with a defined size of 20 nm and a very narrow particle size distribution. NANOPOX® products are used to replace part of the epoxy resin in an existing formulation; typically in the range of 25–40%. Some applications, however, require higher concentrations of nanosilica,. They can be blended with all commercial epoxy resins and cured using any commercial hardener. The introduction of nanosilica into the epoxy formulation improves various properties:
  • increased strength, modulus and hardness
  • improved toughness
  • synergy with conventional fillers, e.g., quartz powders
  • significantly reduced electrocorrosion
  • no change in Tg
As the viscosities of NANOPOX® products and their blends are very low, they are highly suitable for all potting applications, especially when high loading levels are desired. With a size of 20 nm, the silica particles penetrate even tightly meshed copper wiring easily, in areas where conventional fillers cannot penetrate. Using NANOPOX® E 601, you can formulate UV-curable systems. Application: Some examples of applications
  • electrical encapsulation
  • potting resins for example, for generators (combined with conventional fillers)
  • protective resins
  • chip underfill resins

Information provided by Evonik

Vendors:
Available Properties
  • Viscosity
  • SiO2
  
Property Data

This page displays only the text
of a material data sheet.

To see MatWeb's complete data
sheet for this material (including
material property data, metal
compositions, material suppliers,
etc
), please click the button below.

Manufacturer Notes:
Evonik Corporation (Former Evonik Degussa GmbH)

Category Notes
none

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

 

Please read our License Agreement regarding materials data and our Privacy Policy. Questions or comments about MatWeb? Please contact us at webmaster@matweb.com. We appreciate your input.

The contents of this web site, the MatWeb logo, and "MatWeb" are Copyright 1996-2024 by MatWeb, LLC. MatWeb is intended for personal, non-commercial use. The contents, results, and technical data from this site may not be reproduced either electronically, photographically or substantively without permission from MatWeb, LLC.