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Metal adhesives
Resinlab® EP11HT Gray Filled Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfaces and is very thixotropic to resist running and sagging. This product gives very good vibration and impact resistance. It gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. When used at a 1 to 2 A/B ratio, this system has shown excellent ability to withstand cryogenic temperatures (-196° - Liquid Nitrogen) exposure tested by cooling specimens down to -196°C for 5 to 10 minutes and returning to room temperature without cracking and maintaining original bond strength. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP11HT Gray will reach full cure at room temperature within 24-48 hours. Cure time can be accelerated by application of heat. Times and temperatures from 2 hours at 65°C to 20 minutes at 100°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Vendors:
Available Properties
  • Specific Gravity, TM R050-16, Part B
  • Specific Gravity, TM R050-16, Mixed
  • Specific Gravity, TM R050-16, Part A
  • Water Absorption, TM R050-35
  • Viscosity, TM R050-12, Part B, RVT, #7, 2.5 rpm
  • Viscosity, TM R050-12, Mixed
  • Viscosity, TM R050-12, Part A, RVT, #7, 2.5 rpm
  • Hardness, Shore D, TM R050-17
  • Tensile Strength at Break, TM R050-36
  • Tensile Strength, Ultimate, TM R050-36
  • Tensile Strength, Yield, TM R050-36
  • Elongation at Break, TM R050-36
  • Tensile Modulus, TM R050-36
  • Compressive Yield Strength, TM R050-38
  • Compressive Strength, TM R050-38, Break
  • Compressive Strength, TM R050-38, Ultimate
  • Compressive Modulus, TM R050-38
  • Adhesive Bond Strength, TM R050-37, Lap shear; 2024 T3 Al Abraded / MEK Wipe
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear, below Tg
  • CTE, linear, above Tg
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, TM R050-25
  • Pot Life, TM R050-19, Mass: 50g
  
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Category Notes
Plastic

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Metal adhesives
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