| Product Description: EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. Advantages & Application Notes: - Heat-sinking adhesive. It is particularly recommended for thermal management applications where good heat dissipation is necessary.
- The excellent handling characteristics and the long pot life at room temperature for this unique, two component system is obtained without the use of solvents.
- Easy to use. It can be screen printed, machine dispensed, stamped, or hand applied.
- Die-attach adhesive designed to be used in the 300°C range to resist TC wire bonding operations. Meets JEDEC Level III and II packaging criteria.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly; excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
- Passes NASA low outgassing standard ASTM E595 with proper cure
Information Provided by Epoxy Technology |
