Appearance: Black liquid Cure: Heat cure Product Benefits: - One component
- Room temperature flow capability
- Halogen free
- Reworkable
- Good thermal cycling reliability
- Stable electrical performance under standard Surface Insulation Resistance (SIR)
Application: Underfill, Encapsulation Typical Package Application: Chip scale packages and BGA Typical Application: Flex applications LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. Information provided by Loctite® |