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Master Bond adhesives
Henkel Loctite® ECCOBOND UF 3811 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black liquid

Cure: Heat cure

Product Benefits:

  • One component
  • Room temperature flow capability
  • Halogen free
  • Reworkable
  • Good thermal cycling reliability
  • Stable electrical performance under standard Surface Insulation Resistance (SIR)
Application: Underfill, Encapsulation

Typical Package Application: Chip scale packages and BGA

Typical Application: Flex applications

LOCTITE ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.

Information provided by Loctite®

Available Properties
  • Viscosity, CP50-1, Speed 20 rpm
  • Outgassing - Total Mass Loss, WVR, NASA Outgassing
  • Outgassing - Total Mass Loss, TML, NASA Outgassing
  • Collected Volatile Condensable Material, NASA Outgassing
  • Flexural Modulus, Storage, DMA, 3-point bending
  • Surface Resistance, Insulation, after 168 hours 60ºC/90% RH
  • CTE, linear, Cured, Below Tg
  • CTE, linear, Cured, Above Tg
  • Thermal Conductivity
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time
  • Cure Time
  • Cure Time
  • Cure Time
  • Shelf Life
Property Data

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Manufacturer Notes:
Loctite Division of Henkel

Category Notes

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