Key Features: - Cures in shadowed out areas with heat
- Curing temperature 80-85°C
- Excellent elongation
- Outstanding thermal cycling properties
Product Description: Master Bond UV23FLDC-80TK is a moderate viscosity, dual curing, cationic type system. It has an initial cure utilizing UV light along with secondary curing in shadowed out areas by heating, typically 60-90 minutes at 80-85°C. The heat curing cycle is most often used to complete the cure, but at times can even be used to initiate fixturing. UV23FLDC-80TK cures readily in 20-30 seconds when exposed to a UV light source emitting at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts per cm². The rate of cure depends upon the compound’s distance from the light source, the thickness of the section and of course the intensity of the light source. It should be noted that the system can cure in sections up to 0.25 inches deep and can be used for encapsulation. However, when bonding, sections of a few thousandths of an inch are more than adequate. It does not contain any solvents or diluents, has very low shrinkage upon curing, and is not oxygen inhibited. UV23FLDC-80TK bonds well to a wide variety of substrates including metals, glass, and plastics, particularly acrylics, polycarbonates and other optically clear polymers. It has a service temperature range of -80°F to +300°F. It is a superior electrical insulator and is resistant to water, oils, fuels and mild acids and bases. Most noteworthy is its toughness and flexibility allowing it to withstand rigorous thermal cycling. Some applications for this innovative system would be in fiber optics including mounting optics, bonding fiber terminations into ferrules, laminating and sealing glass plates, especially when low stress upon substrates is an important consideration. It also can be used in electronics as an encapsulant and in semiconductor applications as a glob top. Product Advantages: - Dual cure capability; UV, heat, or both
- Highly reliable thermal and electrical insulator
- Can withstand thermal cycling and shock
- Low modulus, low stress
- High elongation
Information provided by Master Bond, Inc. |
