Product Highlights:- Superior optical clarity
- Excellent flow properties
- Phenomenal flexibility
- Very low exotherm, ideal for casting
- Exceptional electrical insulation properties
- Resists mechanical and thermal shocks
Kohesi Bond KB 10473 FLV is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 10473 FLV is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.51. It offers an extensive service temperature range of 4K (-269.15°C) to +120°C. This adhesive fosters outstanding resistance to mechanical and thermal shocks, even at cryogenic temperatures. It offers minimal shrinkage upon cure. KB 10473 FLV adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A and Part B are clear in color. KB 10473 FLV is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where optical clarity, cryogenic serviceability and high flexibility are desired. Typical Applications: - Bonding
- Sealing
- Coating
- Encapsulation
- Potting
Information provided by Kohesi Bond Custom Engineered Adhesives |
