| Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Application Notes:• - This product is the two component version of EPO-TEK® E3001. The two component version can offer advantages such as: lower cost, room temperature shipment instead of pre-mixed and frozen dry ice shipments, and maximum pot-life observed at site.
- Versatility & Cure: snap cures of 90 seconds, fast cures of 15 minutes and traditional oven cures of 1-3 hours can be realized.
- Designed for JEDEC Level III and II packaging criteria.
- Compatible with die sizes up to 250 mil x 250 mil. Also recommended for small die such as LEDs and GaAs devices like 10 mil x 10 mil.
- Beneficial radius of curvature after die-attach cure.
- Compatible with high volume, automated syringe dispensing manufacturing processes.
- Suggested applications:
- Semiconductor: die attach onto lead-frames such as Ag spot die paddle, COB, advanced packages, and hybrid circuits.
- Hybrid Microelectronics: die attach bonding onto ceramic PCB, as well as attaching SMDs onto the same substrate.
- Opto-electronics:
- Die attach of LEDs, LED arrays, LED on PCB, or packaged onto lead-frames.
- Die attach epoxy for near-IR chips used in IRDA (Infra Red Data Acquisition).
- Die-attach bonding of laser diode or photo-diode for fiber optics packaging.
- Many modifications are available, including lower temperature cure, lower stress, longer pot-life, and higher thixotropic index.
Information Provided by Epoxy Technology |
