Product Highlights:- High glass transition temperature
- Resists boiling water
- Castable up to 3 inches; ideal for potting
- Superior chemical resistance
- Exceptional electrical insulation properties
- Capable of passing FDA and NSF standards
Kohesi Bond KB 1452 HT-2FG is a two component, room temperature curing, food grade epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by weight. This epoxy system offers excellent adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1452 HT-2FG passes FDA 175.105 testing and is capable of passing FDA 175.300 and NSF/ANSI 51.4.1 tests. It offers an extensive service temperature range of -50°C to +230°C. This adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is castable up to 3 inches depth. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of fuels, oils and water. It is amber clear in color. KB 1452 HT-2FG is widely used in the food industry for various applications. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
