Applications:

Electronics

Heat sinks for power transistors

CUPROFOR® properties include

• Thermal conductivity to dissipate heat
• Temperature resistance permitting Pb/Sn soldering of the chip without loss of mechanical properties
• Mechanical strength to prevent deformation of heat dissipaters when moulding. CUPROFOR® can play an important part in the manufacture of power transistor heat sinks.

For this application, CLAL offer 1/2 hard profile strips (condition TL2) in long length coils which can be delivered :

• totally or partially Ni coated, with an inlay of Pb/Sn, Ag or other material.

Support media for printed circuits

This application uses the following properties :

• temperature resistance, thus permitting the soldering of the integrated circuit of the DIE PAD, without loss of hardness in the support media
• Outstanding mechanical properties which guarantees the mechanical strength of the LEADS
• A high deformation capacity gives suitability to form external LEADS.

• a high standard of geometrical and dimensional accuracy
• a stress relieving treatment to maintain that the LEADS TIPS are coplanar about the DIE PAD.

The electro-technical field

• Electrical contacts
• Contact mounts
• Pushbuttons
• Conductive parts
• Electrical connections and terminals.

• Heat exchangers
• Seals and washers
• Dephasing rings.

Information provided by CLAL-MSX