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Metal adhesives
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive; Epoxy Encapsulant, Unreinforced

Material Notes: Key Features:
  • Room temperature curing
  • Low viscosity
  • Low shrinkage upon cure
  • Passes NASA low outgassing test
  • Very low coefficient of expansion
  • Superior dimensional stability
Product Description: Master Bond EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) along with meeting NASA low outgassing specifications. It can be used in bonding, coating, sealing and encapsulation applications. This lower viscosity system will cure at room temperature or more quickly at elevated temperatures. To optimize the properties, it is recommended to cure at room temperature for 12-24 hours, followed by a post cure of a few hours at 150-200°F. The CTE is in the range of 15-18 x 10-6 in/in/°C; markedly lower than other systems. Additionally, it has very good thermal conductivity and is highly electrically insulative. EP30LTELO is also noteworthy for its superior dimensional stability. Its linear shrinkage upon curing is exceptionally low, less than 0.01%. EP30LTE-LO bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It is 100% reactive and does not contain any solvents or diluents. This system offers excellent resistance to many chemicals, such as water, fuels and oils, as well as a number of acids and bases. It is serviceable over the wide temperature range of 4K to +250°F enabling it to be using in cryogenic conditions. Part A of this system is off white in color and Part B is clear. Master Bond EP30LTE-LO is especially used in aerospace, optical, electronic, specialty OEM and other applications where an ultra low CTE along with low outgassing is desirable.

Product Advantages:

  • 100% reactive, contains no diluents or solvents
  • Very low shrinkage upon cure
  • Lower viscosity; good flow properties—ideal for small to moderate sized castings
  • Exceptionally low thermal expansion coefficient: about 15-18 x 10-6 in/in/°C
  • Good thermal conductivity while still electrically insulative
  • Superior dimensional stability
  • Passes NASA low outgassing tests

Information provided by Master Bond Inc.

Vendors:
Available Properties
  • Viscosity, Part B
  • Viscosity, Part A
  • Hardness, Shore D
  • Tensile Strength
  • Adhesive Bond Strength, Tensile lap, Aluminum to Aluminum
  • Volume Resistivity
  • Dielectric Constant
  • CTE, linear
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time
  • Cure Time
  • Working Life, After mixing, 100 g batch
  • Shelf Life, in original, unopened containers
  
Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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