LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties. Features: High Stiffness,Laser Direct Structuring,Dielectrics,Circuit Solution,Structural Information provided by SABIC |