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Ensinger SPI
Ensinger TECASINT™ 2011 Polyimide (PI)
Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic
Material Notes: TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction.
  • Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)
  • Excellent long-term thermal stability
  • Outstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)
  • Excellent creep resistance
  • High strength and stiffness properties
  • High purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)
  • Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)

TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.

Information Provided by Ensinger Inc.
Vendors:
Available Properties
  • Density, DIN 53 479
  • Water Absorption, EN ISO 62
  • Water Absorption, EN ISO 62
  • Hardness, Shore D, DIN 53 505
  • Tensile Strength, Yield, EN ISO 527
  • Elongation at Break, EN ISO 527
  • Tensile Modulus, EN ISO 527
  • Flexural Strength, EN ISO 178
  • Flexural Modulus, EN ISO 178
  • Flexural Modulus, EN ISO 178
  • Flexural Modulus, EN ISO 178
  • Flexural Strain at Yield, EN ISO 178
  • Compressive Yield Strength, EN ISO 604, 10% Strain
  • Compressive Strength, EN ISO 604
  • Compressive Modulus, EN ISO 604
  • Charpy Impact Unnotched, EN ISO 179
  • Charpy Impact, Notched, EN ISO 179
  • Compression Set, EN ISO 604, Compression at Break
  • Volume Resistivity, IEC 60093
  • Surface Resistance, IEC 60093
  • Dielectric Constant, IEC 60250
  • Dielectric Constant, IEC 60250
  • Dielectric Constant, IEC 60250
  • Dielectric Constant, IEC 60250
  • Dielectric Strength, ISO 60243-1, DC
  • CTE, linear, DIN 53 752
  • CTE, linear, DIN 53 752
  • Specific Heat Capacity
  • Thermal Conductivity, ISO 8302
  • Maximum Service Temperature, Air
  • Deflection Temperature at 1.8 MPa (264 psi), DIN 53 461
  • Glass Transition Temp, Tg, DMTA
  • Flammability, UL94
  
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Category Notes
Plastic

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