Advantages & Application Notes:

• Recommended for applications where heat dissipation and insulating properties are essential; attaching heat sinks on PCB; heat-sinking in hybrids such as DIP or TO-cans; kovar, aluminum or ceramic packaging.
• Semiconductor applications: die-attach inside plastic IC packages using JEDEC format; die bonding power devices; thermally conductive underfill and glob top for flip-chip assembled die.
• Adhesion to ferrous and non-ferrous metals, ceramic, glass, semiconductor materials and most plastics is excellent.
• Designed for many production methods such as screen printing techniques, automated dispensing, pin transfer or manual applications by hand or spatula.
• Ease of use: long pot-life with low temperature cure of 80°C possible.
• Color change characteristic that indicates the epoxy has reached optimum cure - it goes from an off-white color to an amber color - depending on cure cycle and epoxy thickness.

Information Provided by Epoxy Technology