100 parts resin to 115 parts hardener. TIGA 920-H is a flexible, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications that require high flexibility, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including metals, ceramics and plastic laminates. TIGA 920-H cures at room temperature and can be used as a flexible “cold solder” for heat sensitive parts. It can also be used in the assembly and repair of flexible circuits, electrical components and electronic shielding. Information provided by Resin Technology Group. |