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Master Bond adhesives
Henkel Loctite® ECCOBOND FP4451 Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: Appearance: Black

Cure: Heat cure

Product Benefits:

  • High purity
  • Minimal slumping
  • Green product
Application: Encapsulant - dam

Typical Package Application: BGA and IC memory cards

LOCTITE ECCOBOND FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. LOCTITE ECCOBOND FP4451 used in combination with FP4450, LOCTITE ECCOBOND FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type.

Information provided by Loctite®

Vendors:
Available Properties
  • Specific Gravity
  • Filler Content
  • Brookfield Viscosity, Spindle 7, speed 4 rpm
  • Brookfield Viscosity, Spindle 7, speed 2 rpm
  • CTE, linear, Cured, Below Tg
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, Cured, by TMA
  • Cure Time, plus 90 minutes @ 165°C
  • Cure Time, Alternate Cure Schedule
  • Pot Life, time to double viscosity
  • Gel Time
  • Shelf Life, from date of manufacture
  
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Manufacturer Notes:
Loctite Division of Henkel

Category Notes
Plastic

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