| Appearance: Black liquid Cure: Heat cure Product Benefits: - Halogen-free
- High Tg
- Easy rework
- One component
- Room temperature flow capability
- Excellent thermal cycle performance
- Compatible with most Pb-free solders
- Stable electrical performance under thermal/humidity bias
Application: Underfill, Encapsulation Typical Package Application: CSP, WLCSP and BGA LOCTITE ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling. Information provided by Loctite® |
