Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin

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Master Bond EP21LSCL-1 Two Component, Room Temperature Curing Epoxy Resin
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Product Description: Master Bond Polymer System EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring optical clarity as well as non-yellowing properties. This system can be used for high performance coating, bonding, sealing, encapsulation and casting. It is formulated to cure easily at room temperature or more quickly at elevated temperatures. Master Bond EP21LSCL-1 is 100% reactive and does not contain any solvents or volatiles. It bonds well to metals, glass, ceramics, wood and many plastics and has good chemical resistance to water, fuels, oils, acids and bases. EP21LSCL-1 has great electrical insulation properties. Also of great significance is EP21LSCL-1’s exceptionally long open time. This low exothermic epoxy is ideal for larger castings ranging upwards of 2-3 inches thick. Its service temperature range is from -60°F to +250°F. It has excellent clarity and light transmission and unlike most epoxy formulations, it has very good clarity retention. Product Advantages: Simple 100:60 mix ratio by weight. Low viscosity; easily applied for bonding, sealing, coating and encapsulating. Long working life. Excellent physical strength properties, and good chemical resistance. Adhesion to similar and dissimilar substrates. Non-yellowing characteristics. Electrical insulation properties.Information provided by MasterBond®
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Available Properties
Viscosity, Part B Viscosity, Part A Hardness, Shore D Tensile Strength at Break Tensile Modulus Shear Strength, Al/Al, Tensile lap Volume Resistivity Dielectric Constant Dielectric Strength CTE, linear Maximum Service Temperature, Air Minimum Service Temperature, Air Cure Time Cure Time Pot Life, 100 gram mass Shelf Life, in original closed containers

Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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