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Master Bond adhesives
Evonik VESTAMID® L2141 BK 9.750 Nylon 12, Dry
Categories: Polymer; Thermoplastic; Nylon (Polyamide PA); Nylon 12 (PA12)

Material Notes: VESTAMID® L2141 BK 9.7504 is a heatstabilized polyamide 12 compound for the extrusion of tubing (e.g. fuel lines) and semi-finished products. Tubing according to DIN 73 378, Type: PA 12-HL. Properties of compounds based on PA12 vary little with changing humidity due to low moisture absorption. Parts made of this semi-crystalline material are characterized by exceptional impact strength, low coefficient of friction and good chemical resistance. Pigmentation may affect values. Inside the original and undamaged packaging, the product has a shelf life of at least 2 years when stored in dry rooms at temperatures not exceeding 30°C.
Industrial Sector: Automotive and Mobility, Sustainable
Sustainability: Sustainable electricity
Processing: Injection molding, Extrusion
Delivery form: Pellets, Granules
Resistance to: Heat (thermal stability), UV / light / weathering, Oil / fuels
Electrical: Insulating
Conformity: Automotive
Additives: Lubricant, Unfilled
Processing: Profile extrusion
Special Characteristics: High heat resistant, High viscosity
Color: Black
Additives: Light stabilizer, Heat stabilizer, Processing aids

Information provided by Evonik.

Vendors:
Available Properties
  • Density, ISO 1183
  • Water Absorption, Sim to ISO 62
  • Moisture Absorption, Sim to ISO 62
  • Linear Mold Shrinkage, Flow, ISO 294-4, 2577
  • Linear Mold Shrinkage, Transverse, ISO 294-4, 2577
  • Melt Flow, ISO 1133
  • Melt Flow, ISO 1133
  • Tensile Strength at Break, ISO 527
  • Tensile Strength, ISO 527
  • Tensile Stress, ISO 527
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress
  • Tensile Stress
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Stress, Yield
  • Tensile Strength, Yield, ISO 527
  • Elongation at Break, ISO 527, Nominal
  • Elongation at Yield, ISO 527
  • Tensile Modulus, ISO 527
  • Tensile Modulus
  • Tensile Modulus
  • Tensile Modulus
  • Tensile Modulus
  • Flexural Strength, ISO 178, at conv. Deflection
  • Flexural Strength, ISO 178
  • Flexural Modulus, ISO 178
  • Flexural Strain at Break, ISO 178, at flexural strength
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Secant Modulus, Yield
  • Charpy Impact Unnotched, ISO 179/1eU
  • Charpy Impact Unnotched, ISO 179/1eU
  • Charpy Impact, Notched, ISO 179/1eA, Type of failure: C
  • Charpy Impact, Notched, ISO 179/1eA, Type of failure: C
  • Volume Resistivity, IEC 62631-3-1
  • Dielectric Constant, IEC 62631-2-1
  • Dielectric Constant, IEC 62631-2-1
  • Dielectric Strength, Sim. To IEC 60243-1, AC, S20/P50
  • Dielectric Strength, IEC 60243-1, AC, S20/S20, t.
  • Dissipation Factor, IEC 62631-2-1
  • Dissipation Factor, IEC 62631-2-1
  • Comparative Tracking Index, IEC 60112, test solution A, 50 drops value
  • CTE, linear, Parallel to Flow, ISO 11359-1/-2
  • Melting Point, ISO 11357-1/-3
  • Deflection Temperature at 0.46 MPa (66 psi), ISO 75-1/-2
  • Deflection Temperature at 1.8 MPa (264 psi), ISO 75-1/-2
  • Vicat Softening Point, ISO 306, 50 K/h
  • Vicat Softening Point, ISO 306, 50 K/h
  • Flammability, UL94, IEC 60695-11-10
  • Flammability, UL94, IEC 60695-11-10
  • Melt Temperature, ISO 294, Injection Molding
  • Melt Temperature
  • Mold Temperature, ISO 294, Injection Molding
  • Mold Temperature
  • Injection Velocity, ISO 294, Injection Molding
  • Injection Pressure, ISO 294, Injection Molding
  
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Manufacturer Notes:
Evonik Corporation (Former Evonik Degussa GmbH)

Category Notes
Plastic
PA, Polyamide

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