| ULTRALAM® 3908 bondply is used as a bonding medium between copper and the dielectric material. This product was developed specifically for multi-layer substrate constructions. This adhesiveless film is well suited for high speed and high frequency applications in telecommunication network equipment, high-speed computer data links and other high performance applications. Features and Benefits: Excellent electrical properties - Stable dielectric constant for minimal cross talk between signal layers, allows use of thinner bonding film with very minimal signal loss- Low modulus - Bends easily for flex applications, offers design flexibility and minimizes space requirements
- Extremely low moisture absorption - maintains stable electrical, mechanical and dimensional properties
- Flame resistant - halogen-free, UL94VTM/0 (meets requirements for consumer products)
Typical Applications: - All LCP flex interconnections - high speed switches and routers, Backplane-to-backplane, Data links, Card-to-card
- Hybrid substrates - Handheld and RF devices
Information provided by Rogers Corporation. |
