| Product Description: EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits. Advantages & Application Notes: - This epoxy can be classified as a higher viscosity version of EPO-TEK® E3035, suggested for the following purposes:
- Used for improved stencil printing via small apertures.
- Less flow-out between small pads like 0402 or 0603 caps and resistors.
- Performs exceptionally well as a die attach for small chips such as GaAs, LEDs and diodes.
- Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-seal processes near 300°C, and organic burn-in up to 150°C/1000 hours storage.
- Low levels of water extractable monovalent ions such as Chlorides.
- Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
- Widely used epoxy; popular choice for silver-filled epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT
Information Provided by Epoxy Technology |
