Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. Advantages & Application Notes: - Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing.
- Complies with USP Class VI biocompatibility standards.
- Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing.
- Suggested applications:
- Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon.
- Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics.
- Opto-electronic:
- Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices.
- High Tg and low outgassing are indicative of its high temperature performance.
Information Provided by Epoxy Technology |