Hexcel® HexPly® 954-3 Curing Cyanate Resin

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Hexcel® HexPly® 954-3 Curing Cyanate Resin
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	HexPly® 954-3 is a 350°F (177°C) curing cyanate resin with excellent resistance to moisture absorption, outgassing and microcracking. HexPly® 954-3 is formulated for autoclave or press molding using a standard cure of two hours at 350°F (177°C). Glass transition temperature can be maximized by post curing at 450°F (232°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C2. Typical applications for HexPly® 954-3 include primary and secondary space structures and other applications where dimensional stability is critical. Information provided by HexCel
Vendors:

Available Properties

Density
Water Absorption, 50% GH/EQ
Moisture Absorption at Equilibrium, 55% RH/EQ
Outgassing - Total Mass Loss, ASTM E595, 954-3
Outgassing - Total Mass Loss, ASTM E595, ASTM LIMITS
Collected Volatile Condensable Material, ASTM E595, 954-3
Collected Volatile Condensable Material, ASTM E595, ASTM LIMITS
Tensile Strength, Yield
Elongation at Break
Tensile Modulus
Flexural Yield Strength, Wet (7 day immersion at 71°C)
Flexural Yield Strength
Flexural Yield Strength
Flexural Modulus, Wet (7 day immersion at 71°C)
Flexural Modulus
Flexural Modulus
Dielectric Constant, ASTM D2520, Unconditioned
Dielectric Constant, ASTM D2520, Unconditioned
Dielectric Constant, ASTM D2520, Moisture conditioned (71°C and 95% RH for 140 days)
Dielectric Constant, ASTM D2520, Moisture conditioned (71°C and 95% RH for 140 days)
Dielectric Loss Index, ASTM D2520, Unconditioned
Dielectric Loss Index, ASTM D2520, Unconditioned
Dielectric Loss Index, ASTM D2520, Moisture conditioned (71°C and 95% RH for 140 days)
Dielectric Loss Index, ASTM D2520, Moisture conditioned (71°C and 95% RH for 140 days)
CTE, linear
Glass Transition Temp, Tg, No post cure
Glass Transition Temp, Tg, With post cure

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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