2-part, clear, solvent-free dielectric epoxy casting compound. Processing: 100/11.80 ratio (pbw); Gel time, 100 g (3.5 oz.): 70 minutes; cures in 16 hours at 25°C (77°F); postcure: 2 hours at 100°C (212°F). Applications: solventless casting, adhesive, and coating. |