• Superb insulation of through-holes with high dielectric breakdown properties
• Performs well with glass epoxy laminates
• Capable of withstanding temperatures to 500°F (260°C)
• Adheres well to copper and aluminum
• Readily accepts plating
• No shrinkage during curing and plating to maintain flush surfaces
• Offers controlled particle distribution for high density holes
• Provides excellent machinability
• Extends drill bit life
• Protects plating and etching baths from reactive metals
• Excellent chemical resistance when etching
• Processes void free

SBNA INSUL-PLATETM Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. SBNA Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.

Information provided by Sumitomo Bakelite High Performance Plastics (sbhpp)