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Solder Replacement
RoHS Compliant Adhesives for Solder Replacement
Master Bond offers RoHS compliant, electrically conductive systems to replace lead soldering. These epoxy and silicone adhesives offer low volume resistivity, low outgassing and high temperature resistance.
Lucas-Milhaupt Silvaloy® 720 Silver Based Cadmium Free Filler Metal
Categories: Metal; Nonferrous Metal; Precious Metal; Silver Alloy; Solder/Braze Alloy

Material Notes: Brazing 720 is the silver-copper eutectic composition and in melting it acts like a metallic element, i.e. it melts completely at a single temperature, thus it will quickly flow into long narrow joints. On either silver base of copper base alloys, Braze 720 exhibits a decreased fluidity and an increased remelt temperature due to the solution of either silver or copper in the eutetic. Brazing time and temperature should be minimized to prevent excessive diffusion and erosion of the base metal.

This filler metal has limited wetting ability on iron and/on nickel base alloys. The wetting ability it does have is derived from its copper content. Both iron and nickel have practically no solubility in silver, while nickel is readily soluble in copper and the solubility of iron in copper is sufficient to provide wetting. It is an observed fact that the wetting obtained in good hydrogen atmospheres is superior to that derived from flux protection.

Applications: Braze 720 is generally used to join silver, copper and nickel base alloys in reducing or inert atmospheres or vacuum. It is also widely used to join metallized ceramics to metals in vacuum.

Specifications: This filler metal conforms to the following specifications: AWS A5.8 BAg-8, ASME Boiler & Pressure Vessel Code, Sec. II-C, SFA 5.8 BAg-8

Information provided by Lucas-Milhaupt, Inc.

Vendors:
Available Properties
  • Density
  • Tensile Strength at Break, Copper butt joint
  • Tensile Strength at Break, Nickel-Silver butt joint
  • Tensile Strength at Break, Brass butt joint
  • Electrical Resistivity
  • Melting Point
  • Solidus, Melting Point
  • Liquidus, Flow Point
  • Processing Temperature, Brazing Range
  • Copper, Cu
  • Other, each
  • Silver, Ag
  
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solder replacement adhesives
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