| TRA-BOND F202 is a clear, thixotropic epoxy adhesive recommended for photonic applications requiring exposure to high temperatures or chemical and environmental resistance. This 100% solids system exhibits low exotherm during its short cure cycle and for most applications does not require degassing. It is an excellent choice for adhering to metals, glass and ceramics as well as most plastics. The unique chemistry of TRA-BOND F202 has been successfully used in fiber optic connectors as well as small electronic castings and plastic laminates. For casting applications, use a step cure schedule of 2 hours at 65°C plus 3 hours at 125°C, followed by a post-cure of 1 hour at 150°C if high temperature resistance is required. Information provided by Tra-Con Inc. |
