| TRA-BOND 826H01 is a thermally conductive epoxy system that features a small particle size, spherical filler. This filler makes TRA-BOND 826H01 well suited to applications where extrusion through small-gauge needles is desired. TRA-BOND 826H01 is ideal for die and heat sink attach, staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improves heat transfer while maintaining electrical insulation. TRA-BOND 826H01 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. When fully cured, TRA-BOND 826H01 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils and alcohol. Information provided by Tra-Con Inc. |
