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Metal adhesives
Tra-Con Tra-Bond 826H01 Thermally Conductive Electrically Insulating Compound
Categories: Polymer; Adhesive; Thermoset; Epoxy; Filled/Reinforced Thermoset

Material Notes: TRA-BOND 826H01 is a thermally conductive epoxy system that features a small particle size, spherical filler. This filler makes TRA-BOND 826H01 well suited to applications where extrusion through small-gauge needles is desired. TRA-BOND 826H01 is ideal for die and heat sink attach, staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high-impact bonds at room temperature which improves heat transfer while maintaining electrical insulation. TRA-BOND 826H01 bonds readily to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. When fully cured, TRA-BOND 826H01 provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils and alcohol.

Information provided by Tra-Con Inc.

Vendors:
Available Properties
  • Specific Gravity, Cured
  • Viscosity, Mixed (cp #52, 20 rpm)
  • Hardness, Shore D, 2 hrs @ 65°C
  • Tensile Strength, Yield
  • Adhesive Bond Strength, Lap shear, alum to alum, 2 hrs @ 65°C
  • CTE, linear
  • Thermal Conductivity
  • Glass Transition Temp, Tg, TMA, Ultimate Tg
  • Cure Time
  • Cure Time
  
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Manufacturer Notes:
Tra-Con, Inc.

Category Notes
Plastic

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Metal adhesives
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