Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly. Advantages & Application Notes: - Thixotropic paste-like rheology allows for high speed dispensing and screen printing operations. It can also be applied by hand techniques using spatula, toothpick, or stamping chuck.
- Suggested for Rf/Microwave device packaging found in military, commercial, aerospace and cockpit, and industrial (down-hole petrochemical) circuits.
- > 3 day pot-life allows for mass production yielding low waste.
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