TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 77-1S adhesive exhibits outstanding moisture resistance, eliminating concern about significant electrical leakage after long-term exposure to high humidity conditions. This adhesive withstands 1000 hours at 100°C and 95% relative humidity testing with only a slight drop in insulation resistance. In addition, TRA-BOND 77-1S adhesive exhibits superior application features. Its soft, smooth consistency permits application through fine diameter needles. This adhesive exhibits no tailing or sagging. Small uniform dots may be dispensed for capacitor and resistor attach. To satisfy the seated heights of SOT devices, narrow peaks or multiple dots may be used. TRA-BOND 77-1S adhesive is also ideally suited for application by screening or pin transfer. Information provided by Tra-Con Inc. |