| Description: THERMFLOW® phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronics components and heat sinks. This low thermal resistance path maximizes heat sink performance and improves component reliability. At room temperature, THERMFLOW® materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW® material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERFLOW® pads to achieve performance superior to any other thermal interface materials. THERMFLOW® products are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly. Typical Applications: Microprocessors; Graphics Processors; Chipset; Memory Modules; Power Modules and Power Semiconductors Product Attributes: Superior thermal performance; Ideal solution for mobile microprocessors; Dispersed solder filler offers added thermal performance; Resin system designed for higher temperature reliability; Inherently tacky – no adhesive required and Tabs available for easy removal Information provided by Chomerics |
