- Excellent for copper and difficult-to-solder metals including Alloy 42, Alloy 51, and Nickel alloys
- Effective on bare copper, OSP, HASL, or plated surfaces.
- May be applied in either foam or spray systems.
- Solders single- and double-sided circuit boards.
Description: Superior No. 32 is a high activity, organic acid (OA) foam flux formulated for difficult-to-solder surfaces where activated rosin fluxes and less active OA fluxes cannot be used. This flux combines a unique activation system with a VOC-Free base that is compatible with all latex-peelable solder masks, does not leave a post-solder white residue, and is an ideal choice for high volume soldering operations. The solderability and cleanability of Superior No. 32, along with excellent foaming characteristics and heat stability, provide a moderately low “solids” flux adaptable to a wide variety of board styles, sizes, and thicknesses.Applications: Wave Soldering- To ensure optimum flux activity, a topside temperature of 190-240°F is recommended. Residues from Superior No. 32 are completely water-soluble and can be removed in batch or in-line aqueous cleaning systems. For best cleaning results, wash residues immediately after soldering. A water temperature of 120- 140°F is recommended for optimum results. However, excellent results are routinely achieved at lower water temperatures. The organic base of Superior No. 32 is non-toxic and low foaming. Rinse waters are completely biodegradable. Consult local authorities for disposal regulations. Information provided by Superior Flux |
